Type Of Ceramic Substrate
Time: 2018-12-22 Writer: mingrui
Type Of Ceramic Substrate
Ceramic substrate material with its excellent thermal conductivity and stability, which widely used in power electronics, electronic packaging, hybrid microelectronics and multi-chip modules and other fields.On the eve of today's industrial revolution, it will bring about different changes to the global industrial revolution. The Mingrui ceramic engineer explains the types and characteristics of ceramic substrates as well as the comparison between them.
一、Divide by material
1. Al2O3 is by far the most commonly used substrate material in the electronics industry because of its high strength and chemical stability compared with most other ceramics in terms of mechanical, thermal and electrical properties, and the rich source of raw materials, it is suitable for a variety of technical manufacturing and different shapes.At present, the alumina substrate can be customized in three dimensions.
2, BeO has high thermal conductivity, applied to requires high heat conductivity, but the temperature over 300 ℃ after falling rapidly, the most important thing is that because of its toxicity limits the development of their own.
3, AlN
AlN has two very important properties to be noted: one is high thermal conductivity, and the other is the expansion coefficient matching Si.The disadvantage is that even if there is a very thin oxide layer on the surface, it will have an impact on the thermal conductivity. Only strict control of the material and process can produce a consistent AlN substrate.At present, few domestic AlN production technologies like slyton can achieve mass production. Compared with Al2O3, AlN price is relatively high, which is also a small bottleneck restricting its development.However, with the improvement of economy and technology, this bottleneck will eventually disappear.
二、 according to the manufacturing process to divide
HTCC, LTCC, DBC, DPC and LAM are the five kinds of common ceramic heat dissipation substrates at this stage, among which LAM belongs to the patent technology cooperated by slyton and the national optoelectronics laboratory of huazhong university of science and technology. HTCCLTCC belongs to sintering process, and the cost will be high.
While DBC and DPC for domestic development of mature, in recent years and the energy production of professional and technical, DBC is the use of high temperature heating combines Al2O3 and Cu plate, the technical bottleneck is not easy to solve between Al2O3 and Cu board micro porosity occurrence problem, which makes the energy production and yield of the product by bigger challenges, and DPC technology is using the direct copper plating technology, the Cu deposit on the Al2O3 substrate, the technology combining material and thin film technology, its product is the most commonly used in recent years the radiating ceramic substrate.However, its material control and process technology integration ability requirements are higher, which makes it into the DPC industry and stable production of the technical threshold is relatively high.LAM technology is also known as laser rapid activation metallization technology.
1. HTCC (high-temperature co-fired Ceramic)
Also known as temperature co-firing multilayer ceramic, HTCC and LTCC manufacturing process is very similar to that of the main differences of HTCC is no join glass ceramic powder, as a result, HTCC to high temperature of 1300 ~ 1600 ℃ environment dry hardened into embryo, then the same drill in the guide hole to fill hole screen printing and printing circuit, because of the sinter temperature is higher, making the choice of metal conductor materials limited, the main material for high melting point but poor conductivity of tungsten, molybdenum, manganese...Metal, and finally laminated sintering molding.
2. LTCC (low-temperature co-fired Ceramic)
LTCC is also called low temperature co-firing multilayer ceramic substrate, the technology must first inorganic alumina powder with about 30% ~ 50% glass material and organic adhesives, make its mixing mud slurry, and then use scraper scrape paste into flake, then through a drying process will flake pulp formed thin pieces of embryo, and then according to the design of the layers of conduction holes, as a signal transfer in each layer, LTCC internal wiring with screen printing technology, born in embryo do fill in the hole and the printed circuit, the internal and external electrode can be respectively used silver, copper, gold and other metals, finally will do laminated layers,Placed in the middle of 850 ~ 900 ℃ sintering furnace sintering molding, can be completed.
3. DBC (Direct Bonded Copper)
Directly apply the technology is the use of copper oxygen eutectic liquid copper apply directly on the ceramics, its basic principle is to apply is received before or between copper and ceramics in the process of introducing the right amount of oxygen, within 1065 ℃ ~ 1083 ℃, copper with oxygen to form Cu - O eutectic liquid, DBC technology using the eutectic liquid on the one hand, react with ceramic substrate generated CuAlO2 or CuAl2O4 phase, on the other hand infiltration copper foil to realize the combination of ceramic substrates and copper.
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